Home > Thermal Interface Materials >

9504 One Component Pre Curing Type Thermal Gel No Residual Stress After Sizing, Effectively Protecting Electronics

Product Categories

PV Backsheet Material [5]
PV Sealant [4]
Potting Compound [1]
Industrial Adhesive [36]
UV Bonding Adhesive [1]
Automotive Adhesive [15]
Water Resistance Glue [2]
Bond And Seal Adhesive [18]
Packaging Adhesive [5]
Construction Adhesive [5]
Electronic Potting Compound [27]
Conformal Coating [5]
Thermal Interface Materials [25]
UV Light Cure Adhesive [10]
Battery Cell Adhesive [2]
Battery Potting And Encapsulation [4]
Engineering Adhesives [38]
Railway Industry Adhesive [1]
SMD LED PCB [1]
Glue For Car Parts [22]
Automotive Assembly Adhesive [28]
Automotive Aftermarket Products [24]
Window Door Sealant [14]
Curtain Wall Sealant [4]
Solvent Based Adhesives [8]
Solventless Adhesives [7]

Shanghai Huitian New Material Co., Ltd

Trust Seal

Verified Supplier

Credit Check

Supplier Assessment

Contact Now

9504 One Component Pre Curing Type Thermal Gel No Residual Stress After Sizing, Effectively Protecting Electronics

Name: 9504 One Component Pre Curing Type Thermal Gel No Residual Stress After Sizing Effectively Protecting Electronics
Brand: HUITIAN
Price: 1 USD

Quality 9504 One Component Pre Curing Type Thermal Gel No Residual Stress After Sizing, Effectively Protecting Electronics for sale

Brand Name : HUITIAN

Model Number : 9504

Certification : RoHS

Place of Origin : CHINA

MOQ : 200 kg

Price : Negotiation

Payment Terms : L/C, T/T

Supply Ability : 2000T/Month

Delivery Time : 5-8 days

Packaging Details : 30cc/tube; 300cc/cartridge

Physical Form : Paste

Color : Pink

Density : 3.2 g/cm³

Extrusion ﬂow rate : 20 g/min

Volume resistivity : 1.0*10^13 Ω∙cm

Dielectric strength : 8.0 KV/mm

Thermal Conductivity : 4 W/(m•K)

Contact Now

9504 TDS-EN.pdf

9504 One-Component Pre-Curing Type Thermal Gel, which has no residual stress after sizing, effectively protects precision electronic components from damage

Product Description

Pink paste gel
One-part pre-curing type
Silicone thermal conductivity complex

Product Features:

High thermal conductivity 4W/m∙K
Very small BLT and very low thermal resistance
Soft adhesion and self-adhesive properties after dispensing
Excellent chemical and mechanical stability
No residual stress after sizing, effectively protects precision electronic components from damage

Technical Parameters

Reference standard	Item	Unit	Value
GB/T 13354	Density	g/cm³	3.2
--	Extrusion rate (30ccEFD@90psi)	g/min	30
ISO22007	Thermal conductivity	W/ m·K	4.0
GB/T2408	Flame retardant	/	V0
GB/T2408	Volume resistivity	Ω·cm	≥1.0×10¹³
ASTM D149	Dielectric strength	Kv/mm	8.0
ASTM D5470	Minimum thickness	mm	0.1

Main Applications:

Bare die chip low-stress mounting
Heat dissipation field of 5G communication boards
Automotive electronic equipment
Smart phone modules and consumer-electronics
Other high-value boards need to be reworked

Packing:

30cc/tube; 300cc/tube

Storage:

Store below 35°C in a cool and dry place.

Shelf life is 6 months.

9504 One Component Pre Curing Type Thermal Gel No Residual Stress After Sizing, Effectively Protecting Electronics

Product Tags:

No Residual Stress Type Thermal Gel

After Sizing Type Thermal Gel

Protecting Electronics Type Thermal Gel

9504 One Component Pre Curing Type Thermal Gel No Residual Stress After Sizing, Effectively Protecting Electronics Images

Inquiry Cart 0

Send your message to this supplier


*From:	Your email address is incorrect!
*To:	Shanghai Huitian New Material Co., Ltd
*Subject:	Subject is empty!
*Message:	For the best results, we recommend including the following details: -Self introduction -Required specifications -Inquire about price/MOQ Characters Remaining: (0/3000) Please enter 20 to 3000 characters to contact this supplier!